Aptos NCP (cmos package) and Film coating
NCP package structuresummary
NCP sensor package
Main structure (13M)
Module has without DAM design. Can reduce assembly and parts cost.
Size: 8.5*8.5*4.6mm (without extra plastic DAM)
Module for NCP
WFP (CMOS) non-wire tech.
WFP sensor package
Main structure (13M)
Module structure in WFP) , It Can reduce Module height with SMT (BGA) process.
Comparison table of COB and WFP
NCP key process
2015.16 NCP Product Roadmap
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