SiP integrates subsystem and multi-chips into single package. By integrating bare die, substrate, passive components, capacitors, resistors, connectors, antenna into single package, we could provide cost-effective, small-dimension and high performance complete system or sub-system. SiP could not only save development time and minimize PCB dimension, but also could provide taylor-made design in terms of customers. Take LTE module of Aptos as examples, the dimension is decreased up to 20X20X1.73.

Taylor-made SiP package technology
Cost effective
Low power consumptions
Thin, light, smaller dimension which could save space
Single package style which could reduce production process of customers.
Lead-free and environmental friendly production process

Years of SMT experiences, Aptos could reduce the minimum distance between components to 0.15mm, which could effectively reduce PCB size