TSOP48
Thin Small Outline Package (TSOP)
TSOP memory chips are made around the pin, using SMT technology (surface mount technology) directly attached to the surface of the PCB.

When TSOP package dimensions, the parameter (when a substantial change in current, causing the output voltage disturbance) decreases, for high frequency applications, operation more convenient reliability is relatively high. simultaneously TSOP package with high-yield, low price, etc., so it has been an extremely of applications