SMT(surface mount technology), which mount various active and passive components into the PCB can provide complete systems or sub-systems with low cost, small size and high performance. And our current precision and yield rate of products are higher than the industry standard.  BGA : Ball Grid Array (BGA) package utilizes solder ball matrixs coonect with circuit boards in the bottom of substrate, and use solder balls to replace traditional leadfram as pin .The advantages of BGA package are good low power inductors, good heat dissipation, and can effectively reduce the package size. It is the mainstream of futire.  Features: Aptos devotes in process improvement continuously, and capacities are as follows: