BGA/LGA
Aptos provides custom Ball-grid Arrays (BGA) and Land Grid Arrays (LGA) IC packages. Ball grid array (BGA) package uses solder ball on bottom substrate.

The solder ball matrix and circuit board connect the metal ball to replace the traditional lead frame. LGA package is thinner than a standard BGA package design.

Aptos’ custom packaging technologyfeatures professional 1mil wafer grinding and 16 die stacking technology, the thin package products provide high-capacity and small size for the market demand. Moreover, Aptos’ BGA/LGA IC package includes critical quality control process and comply with the international certification of vehicle specifications ISO 16949.

Feature:
Custom BGA/LGA IC package technology
16 die stacking technology
1mil wafer grinding technology
Enhance electrical and thermal performance.
Space saving
Comply with vehicle specifications.
Certification by international companies
Larger capacity for storage
Lead free and green environmental protection process