QFN（Quad Flat No-lead）
Base on lead fram of the leadless package technology，the shortest distance between the inner and outer pin，Provide more excellent electrical characteristics.

PTP QFN（Paper Thin Package Quad Flat No-lead）New process and new technology to replace lead fram of QFN，the package size lighter / thin / short / small，while products better heat dissipation / low power consumption / more excellent electrical characteristics， PTP QFN is a cost effective package solution。

Pin to pin compatible to QFN, aQFN & BGA…etc.

PTP build up replace substrate

Feature:
Fine pitch for easier wire bond design as BGA
Excellent thermal and electrical performance
Cost effective approaching 10% lower than BGA
Low profile, small footprint and light weight Ultra thin package
Available for both wire bond & flip chip bonding
Good SMT performance
Low to medium pin count package
I/O design free-form (Circle or Square)