Wafer grinding
Besides 1mil wafer grinding technology, the Grinding machine of Aptos is also with the function of
wafer polishing and Gettering process (preventing Cu diffusion); Aptos also can provide the wafer
backside tape process of DAF, FOW, Dicing tape. 1mil wafer grinding technology also apply to
wafer reclaim service, Aptos provide grinding solution for wafer top/ backside coating layer.
Wafer dicing/ wafer saw
The wafer saw machine of Aptos is with the function of dual cutting function which can prevent
top side and back side chipping issue; meanwhile, and preventing SiC-particulate remaining on
the wafer pads issue after sawing.
Substrate saw + Tape reel
Our unique wafer saw technology also can apply to substrate saw, Aptos provide 12”(substrate
diameter: 300 mm) & 8”(substrate diameter: 200 mm) substrate saw service; besides substrate
saw service, we also have “Tape reel” machine; Aptos is with the solution of substrate saw + tape
reel process.
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With the 1mil wafer grinding technology ability leading in the field and advanced wafer saw
