Multi Chip Package (MCP)
Multi Chip Package (MCP) is an extension of new technologies of semiconductor multi-chip package and system-level package.The design stack multiple memory chips including NOR Flash, NAND Flash, Low Power SRAM and Pseudo SRAM package as a MCP. MCP is suitable for portable and micro electronic products such as digital cameras, smart phones, multimedia phones, satellite navigation systems, and Tablet PC.

System in Package (SiP)
System in Package (SiP) integrates Sub-system and multi-chip into one package. Through bare die and substrate integration plus a combination of passive components, like capacitors, resistors, connectors and antenna combined in a single package on the package substrate to provide a complete system or sub-system that features lower cost, small size and high efficiency.

Aptos’ SiP / MCP module design department has professional stacking, PWLB (WLCSP / Fan Out) and PTP packaging technology that not only save development time and reduce PCB design area, but also provides best package solution to reduce EMI and enhance thermal management. Our product design is also widely used in several wafer processes integrated design package. Aptos aims to provide best-quality, miniaturization, modular and competitively priced SiP / PoP / MCP products to customers. We also supply customize solution at your request.

Feature:
Custom MCP/SiP package technology
16 die stacking technology
Professional stacking, PWLB and PTP technology
Lower cost
Enhance electrical management
Effective system integration that favorable for product extension
Single package model to simply production process
Lead free and green environmental process