群豐科技股份有限公司 公告

一、   本公司經股東會於民國114613日決議解散,並選任清算人為方則樺,清算人於民國114620日就任。清算人姓名:方則樺、地址苗栗縣竹南鎮科北一路211電話03-758-6068

二、   凡本公司債權人,請自本公告之日起三個月內檢附債權憑證向清算人申報債權,逾期未申報者不列入清算範圍內申報債權函請寄至清算人之代理人:胡毓真律師,地址:台北市信義區忠孝東路五段4123樓之1,電話:02-2722-5992

三、   因群豐科技股份有限公司有財產不能清償債務之情事,清算人就任後業依公司法第89條及第334條規定向法院聲請宣告破產。請各債權人申報債權,以利清算人列入債權人清冊中祈能透過法院破產程序,將所有剩餘資產分配予各債權人,俾利各債權人能受公平分配

四、   如就本公司清算、破產程序有所疑義,或有申報債權相關事宜,請洽忠正法律事務所(電話:02-2722-5992,聯絡窗口:王俊閔顧問)

 

日期:114625

 

Aptos Technology 群豐科技股份有限公司
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  About Aptos > Company Profile
 

Aptos Technology was founded in March 2006. With its exclusive and unique patent process,
Aptos has expanded into the microSD assembly field. Through continuous innovative
research and development, Aptos has also successfully developed and integrated various
SiP-System in Package technologies and applications in the past few years. In the
future, Aptos will devote itself solidly and steadily to the following objectives with the
expectation to become a leading manufacturer in SiP assembly field.

By applying the management model of specialist managers, Aptos will be dedicated to each and every professional field with integrity and team spirit, in pursuit of perfection, excellency and growth.
Aptos' unique and leading edge is its key to success. Aptos is in hold of the most advanced SiP assembly technology, and is continuously developing system products in order to provide comprehensive customized services.
With its substantial managing experiences, Aptos has installed automatic and high-precision equipment, providing its customers with Total Solution Service with realtime and flexible production. Not only will Aptos significantly shorten process time, it will also raise production yield and product stability.
Aptos is dedicated to be the best by focusing on every single work detail, with the determination to create high quality products to satisfy the customers' needs. With our stable customer base and strong strategic alliances, we actively seek to grow with our customers in order to achieve a win-win situation.

In the future, Aptos will continue to develop its versatile technologies, integrating NAND Flash, wireless communication module, CMOS module, multi-chip stacking and Fan-out Wafer Level Package SIP assembly technologies, in order to explore the unlimited possibility of compact and slim packages and highly integrated system products. 



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