Solder Paste Inspection (SIP): currently dimensions of electronic components are getting smaller and smaller, solder positions have to more precise to ensure quality. SPI could insure solder quality to prevent failure unit from leaking to next stop process to improve yield rate and production capacity

Aptos SMT production process set up checkpoints for operators, material, material feeders and equipments to ensure material correctness and prevent wrong material.

Aptos printer is equipped with 2D camera which could inspect solder printing status. 1. Paste the extent of coverage (Over or less) 2. position 3. contact of solder

1. Past Experiences:
~ Advanced SMT mount. Ex. Storage: SSD, Micro SSD, SD, USB
SiP: WIFI+BT, BLE, LTE
2. Problems-Solving Ability:
~ Lab Test Capability: X-ray, Dye dry test, Cross-section, SAT, SEM, IV curve.
~ Repair Equipments: BGA rework station
3.Improvement of Production Process:
~ Improvement of Production Yield Rate: Stencil / carrier designation, material expt,
~ Improvement of Production Efficiency: PCB strip layout, process flow improvement.
4. Ability to Improve Products Yield Rate.~ We have done:
a. Low welting point solder paste study.
b. Special chip mount study.
c. Flux clean study.
d. Conductive/ nonconductive glue dispensing.