Aptos’s strength :

• Technology – Ultra-thin wafer + multi-die stacking + patented break-through processes & technologies.
• Full Turnkey-Service – In-house process to handle customer’s requirements from flash wafer in to shipping finish product out
• One stop shopping – Multi-packages ( more than the listed ) available to offer flexibility of planning and time to market

Micro SD

• Outstanding outline dimension accuracy
• Up to 4 die stacking construction for MP
• Perfect shape - smooth side wall edge, radius and accurate 30 degree chamfer
• No conductive particle after insertion test
• Easy process control and short cycle time

SD Card

• SIP assembly technology
• Up to 4 die stacking construction for MP
• In-house passive component integration
• Easy process control and short cycle time

Micro PD

• SIP assembly technology
• Up to 4 die stacking construction for MP
• In-house passive component integration
• Easy process control and short cycle time
• Unique housing design catalog available